1. The PCB must have a Mark point corresponding to the positioning of 
the entire board on the diagonal of the long side of the board.

Chips with an IC pin center distance of less than 0.65mm on FS 
Technology’s circuit boards should have a Mark point corresponding to 
the chip positioning on the diagonal of the long side of the IC; when 
there are patches on both sides of the pcb, both sides of the pcb should 
be Add Mark points based on this article.

2. The edge of the PCB should retain the 5mm process edge (the minimum 
spacing requirement for the machine to clamp the PCB).

Chips whose center-to-center distance between IC pins is less than 
0.65mm should be greater than 13mm from the edge of the board (including 
the edge of the process); the four corners of the board should be 
chamfered with a φ5 arc. Judging from the current bending degree of PCB 
wings, the optimal splicing length is about 200mm (equipment processing 
size: maximum length is 330mm; maximum width is 250mm), try not to spell 
in the width direction to prevent bending during production.

3. MARK point functions and categories.

Mark points, also known as fiducials, provide a common measurable point 
for all steps in the assembly process to ensure that each assembly 
device can accurately locate the circuit pattern. Therefore, FS 
Technology believes that the Mark point is crucial for SMT production.

4. MARK point design specification recommended by our department.

1) Shape: It is recommended to mark the Mark point as a diameter: 
R=1.0mm solid circle;
2) Form a complete MARK point, including marked points (or feature 
points) and open areas.
3) Position: The Mark point is located at the relative position of the 
diagonal on the veneer or puzzle, and is separated as much as possible; 
it is best to distribute it at the longest diagonal position (such as 
the MARK point position diagram).
4) In order to ensure the installation accuracy requirements of FS 
Technology, SMT requirements: each PCB must have at least one pair of 
MARK points for the SMT machine to identify, and there must be a 
single-board MARK (when assembling).
Panel MARK or combined MARK only play a role of auxiliary positioning.
5) When assembling, the relative positions of the MARK points of each 
single board must be the same.
The position of the MARK point cannot be moved for any reason, resulting 
in asymmetrical position of the MARK point of each board;
6) All MARK points on the PCB are only valid: two MARKs appearing in 
pairs on the same diagonal are valid.
So MARK points must appear in pairs to be used (MARK point location 
map).

fs tech

7) The distance between the MARK point (edge ​​of the open area) and the 
edge of the PCB must be ≥5.0mm (minimum spacing requirements for the 
machine to clamp the PCB)

8) Requirements for open areas.

Around the mark point marking, there must be an open area with no other 
circuit features or markings.
The radius of the circle in the open area is R≥2R, where R is the radius 
of the MARK point.
When R reaches 3R, the machine recognition effect is better.

9) PBC Materials

Mark point markings can be bare copper, which is protected by a 
transparent anti-oxidant coating. If solder mask (solder mask) is used, 
the mark point or its open area should not be covered.

10) PBC Contrast.

A. The best identification performance is achieved when there is a high 
contrast between the mark point markings and the matrix material of the 
printed board.
B. The internal background must be the same for all mark points.
MARK classification:
1) Mark points are used for solder paste printing and component 
placement optical positioning.
According to the function of Mark points on the PCB, it can be divided 
into panel Mark points, single-board Mark points, local Mark points 
(also known as device-level Mark points),
2) There should be at least three Mark points on the edge of the FS 
technology paneling process and the veneer that does not need paneling, 
distributed in an L shape, and the diagonal Mark points are asymmetrical 
about the center.
3) If there are mounted components on both sides, then there must be 
mark points on each side.
4) There should be mark points on the board that needs to be assembled 
as much as possible. If there is no place to place the mark point, the 
mark point cannot be placed on the board.
5) For QFP with lead center distance ≤ 0.5mm and BGA equipment with 
center distance ≤ 0.8mm, the local Mark point should be set near the 
diagonal of the component center point for accurate positioning.
6) If several SOP devices are relatively close (≤100 mm) to form an 
array, they can be regarded as a whole, and two local Mark points are 
designed at their diagonal positions.